High Light Power Density DUV-LED Packaging Using High Density TSV in Silicon Cavity and Laser-Glass-Frit-Bonded Glass Cap

Hirofumi Chiba, Yukio Suzuki, Yoshiaki Yasuda, Tianjiao Gong, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

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