High Light Power Density DUV-LED Packaging Using High Density TSV in Silicon Cavity and Laser-Glass-Frit-Bonded Glass Cap

Hirofumi Chiba, Yukio Suzuki, Yoshiaki Yasuda, Tianjiao Gong, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports an improved deep ultraviolet LED (DUV-LED) packaging based on Si MEMS process technology. The Si package (Si-PKG) consists of a cavity formed by Si crystalline anisotropic wet etching and through-silicon vias (TSV) filled with electroplated Cu. The Si-PKG is hermetically sealed by laser local heating of screen-printed glass frit. This technology allows for the use of a DUV-transparent glass substrate, which has an unmatched coefficient of thermal expansion (CTE). Using a high-density array of TSV capped with AuSn solder bumps, the cooling performance of the DUV-LED has been greatly improved. As a result, an optical output of 114% (50 mW) and a volumetric light power density of 380% (14 mW/mm3) were recorded compared with the conventional AlN-packaged device. The developed compact low-cost Si-PKG is promising for wider applications of the DUV-LED including the disinfection of the new coronaviruses.

Original languageEnglish
Title of host publication21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1162-1165
Number of pages4
ISBN (Electronic)9781665412674
DOIs
Publication statusPublished - 2021 Jun 20
Event21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021 - Virtual, Online, United States
Duration: 2021 Jun 202021 Jun 25

Publication series

Name21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021

Conference

Conference21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
Country/TerritoryUnited States
CityVirtual, Online
Period21/6/2021/6/25

Keywords

  • Deep ultraviolet LED (DUV-LED)
  • Hermetic sealing
  • Through-silicon via (TSV)
  • Wafer-level packaging

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Control and Optimization
  • Instrumentation

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