High-frequency propagation on printed circuit board using a material with a low dielectric constant, a low dielectric loss, and a flat surface

Hiroshi Imai, Masahiko Sugimura, Masafumi Kawasaki, Akinobu Teramoto, Shigetoshi Sugawa, T. Ohmi

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

For the next-generation printed circuit boards with a fine pattern, low power consumption and high-speed propagation with low variation of signal propagation must be satisfied. In order to meet such requirements, we investigated a dielectric material for printed circuit boards which has three superior features: low dielectric constant (permittivity), low dielectric loss, and a flat surface with sufficient adhesion force for plating metal. The propagation loss of a microstrip line on the developed material is about 40% of the conventional material at 10 GHz. Significant reduction of the manufacturing fluctuation of the developed materials is achieved due to the flat surface. We adopted a distributed constant model to the propagation results and revealed that the significant reduction of the propagation loss is caused by the flat surface and low dielectric loss. This technology greatly contributes to the next generation of printed circuit boards.

Original languageEnglish
Pages (from-to)415-423
Number of pages9
JournalIEEE Transactions on Components and Packaging Technologies
Volume32
Issue number2
DOIs
Publication statusPublished - 2009 Jan 30

Keywords

  • Dielectric losses
  • Dielectric materials
  • Microstrip
  • Microwave propagation
  • Printed circuits
  • RLC circuits
  • Scattering parameter measurement
  • Time-domain reflectometry
  • Transmission line measurements

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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