High density electrical feedthrough fabricated by deep reactive ion etching of Pyrex glass

X. Li, T. Abe, Y. Liu, M. Esashi

Research output: Contribution to conferencePaper

28 Citations (Scopus)

Abstract

This paper reports a new fabrication technology of Pyrex glass with a fine pitch electrical feedthrough. Small through holes (40-60 μ in diameter) in Pyrex glass plate have been fabricated using deep reactive ion etching in sulfer hexaflouride (SF6) plasma. By filling the through holes with electroplated metal, the fine pitch electrical feedthrough in Pyrex glass plate becomes enable technology. Pyrex glass can be anodically bonded with silicon. Thus, our technology will be widely used for high density electrical feedthrough to the backside of a plate. The applications of the technology to micro probe array used for high density data storage and packaged devices are expected.

Original languageEnglish
Pages98-101
Number of pages4
Publication statusPublished - 2001 Jan 1
Event14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, Switzerland
Duration: 2001 Jan 212001 Jan 25

Other

Other14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)
CountrySwitzerland
CityInterlaken
Period01/1/2101/1/25

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Li, X., Abe, T., Liu, Y., & Esashi, M. (2001). High density electrical feedthrough fabricated by deep reactive ion etching of Pyrex glass. 98-101. Paper presented at 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001), Interlaken, Switzerland.