High density 3D LSI technology using W/Cu hybrid TSVs

M. Murugesan, H. Kino, A. Hashiguchi, C. Miyazaki, H. Shimamoto, H. Kobayashi, T. Fukushima, T. Tanaka, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

25 Citations (Scopus)

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