High-bandwidth data transmission of new transceiver module through optical interconnection

Yuka Ito, Shinsuke Terada, Shinya Arai, Koji Choki, Takafumi Fukushima, Mitsumasa Koyangi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents optical interconnection for module-to-module length for high-performance computing system. A new multi-chip transceiver module consisting of optical components, IC chips, flexible printed circuits (FPCs), and a sheet of optical polynorbornene (PNB) waveguides was fabricated by simple packaging processes. Waveguide sheet with micromirrors and the FPCs mounting of O/E devices were completed independently. After that, the waveguide sheet was aligned to optical devices on FPCs passively. Optical loss for waveguide including propagation and micromirror couplings was 3.30 dB. We successfully demonstrate high-bandwidth 100-Gbps (12.5 Gbps/ch x 8 channels) data transmission with the module, on which two 4-channel vertical-cavity surface emitting laser (VCSEL) arrays, one VCSEL driver (VD), two 4-channel PD arrays, and one transimpedance amplifier/limiting amplifier (TIA/LA) were mounted.

Original languageEnglish
Title of host publication2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs
Publication statusPublished - 2011 Dec 1
Event2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan
Duration: 2012 Jan 312012 Feb 2

Publication series

Name2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Other

Other2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
CountryJapan
CityOsaka
Period12/1/3112/2/2

ASJC Scopus subject areas

  • Control and Systems Engineering

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