Heterogeneously-integrated microdevices

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The integration of heterogeneous components or materials is a promising approach to create more functionalized, higher performance and smaller devices. However, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, significant efforts have been made in the world. This paper introduces two approaches by wafer bonding and film transfer, which have been developed in our group.

Original languageEnglish
Title of host publication2016 IEEE International Electron Devices Meeting, IEDM 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages18.5.1-18.5.4
ISBN (Electronic)9781509039012
DOIs
Publication statusPublished - 2017 Jan 31
Event62nd IEEE International Electron Devices Meeting, IEDM 2016 - San Francisco, United States
Duration: 2016 Dec 32016 Dec 7

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)0163-1918

Other

Other62nd IEEE International Electron Devices Meeting, IEDM 2016
CountryUnited States
CitySan Francisco
Period16/12/316/12/7

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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