Heterogeneous integration of MEMS by adhesive bonding

M. Esashi, S. Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Wafer-level adhesive bonding has been applied for the fabrication of microsystems which have heterogeneous components on LSI (large scale integrated circuit). Devices or functional materials formed on a carrier wafer are transferred to a LSI wafer, which enables versatile heterogeneous integration, overcoming process incompatibility. Based on the developed process technology, RF resonators, a piezoelectric microswitch, tactile sensors, a parallel electron beam source etc. have been demonstrated.

Original languageEnglish
Title of host publicationULSI Process Integration 9
EditorsJ. Murota, C. Claeys, S. Deleonibus, M. Tao, H. Iwai
PublisherElectrochemical Society Inc.
Pages243-252
Number of pages10
Edition10
ISBN (Electronic)9781607685395
DOIs
Publication statusPublished - 2015
EventSymposium on ULSI Process Integration 9 - 228th ECS Meeting - Phoenix, United States
Duration: 2015 Oct 112015 Oct 15

Publication series

NameECS Transactions
Number10
Volume69
ISSN (Print)1938-6737
ISSN (Electronic)1938-5862

Other

OtherSymposium on ULSI Process Integration 9 - 228th ECS Meeting
CountryUnited States
CityPhoenix
Period15/10/1115/10/15

ASJC Scopus subject areas

  • Engineering(all)

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