TY - GEN
T1 - Heterogeneous integration by wafer-to-wafer transfer technology
AU - Tanaka, Shuji
PY - 2014/1/1
Y1 - 2014/1/1
N2 - Laser-assisted selective die transfer for wafer-level integration and packaging between different sizes of dies was developed, and applied to a 2 GHz chip-size-packaged film bulk acoustic wave oscillator. Wafer-to-wafer thin film transfer by laser-assisted peeling and metal-metal bonding was developed and applied to a monolithic bandwidth tunable surface acoustic wave (SAW) filter for TV white space cognitive wireless LAN.
AB - Laser-assisted selective die transfer for wafer-level integration and packaging between different sizes of dies was developed, and applied to a 2 GHz chip-size-packaged film bulk acoustic wave oscillator. Wafer-to-wafer thin film transfer by laser-assisted peeling and metal-metal bonding was developed and applied to a monolithic bandwidth tunable surface acoustic wave (SAW) filter for TV white space cognitive wireless LAN.
UR - http://www.scopus.com/inward/record.url?scp=84906981367&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84906981367&partnerID=8YFLogxK
U2 - 10.1109/LTB-3D.2014.6886172
DO - 10.1109/LTB-3D.2014.6886172
M3 - Conference contribution
AN - SCOPUS:84906981367
SN - 9781479952618
T3 - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
BT - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
PB - IEEE Computer Society
T2 - 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Y2 - 15 July 2014 through 16 July 2014
ER -