Heterogeneous Integration at Fine Pitch (≤ 10 μm) Using Thermal Compression Bonding

Adeel A. Bajwa, Sivachandra Jangam, Saptadeep Pal, Niteesh Marathe, Tingyu Bai, Takafumi Fukushima, Mark Goorsky, Subramanian S. Iyer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

32 Citations (Scopus)

Abstract

The scaling of package and circuit board dimensions is central to heterogeneous system integration. We describe our solderless direct metal-to-metal low pressure ( 20 MPa. The combined reduction of dielet interconnect pitch, dielet-to-dielet spacing and trace pitch will enable a Moore's law for packaging.

Original languageEnglish
Title of host publicationProceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1276-1284
Number of pages9
ISBN (Electronic)9781509043323
DOIs
Publication statusPublished - 2017 Aug 1
Externally publishedYes
Event67th IEEE Electronic Components and Technology Conference, ECTC 2017 - Lake Buena Vista, United States
Duration: 2017 May 302017 Jun 2

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other67th IEEE Electronic Components and Technology Conference, ECTC 2017
CountryUnited States
CityLake Buena Vista
Period17/5/3017/6/2

Keywords

  • Dielet-to-dielet spacing
  • Heterogeneous integrations
  • Interconnect pitch
  • Siclicon Interconnect Fabric (Si-IF)
  • Thermal compression bonding (TCB)

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Bajwa, A. A., Jangam, S., Pal, S., Marathe, N., Bai, T., Fukushima, T., Goorsky, M., & Iyer, S. S. (2017). Heterogeneous Integration at Fine Pitch (≤ 10 μm) Using Thermal Compression Bonding. In Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017 (pp. 1276-1284). [7999845] (Proceedings - Electronic Components and Technology Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2017.240