Heterogeneous integration and wafer-level packaging of MEMS

Masayoshi Esashi, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingChapter

Original languageEnglish
Title of host publicationMems Packaging
PublisherWorld Scientific Publishing Co. Pte Ltd
Pages141-169
Number of pages29
ISBN (Electronic)9789813229365
ISBN (Print)9789813229358
DOIs
Publication statusPublished - 2018 Jan 3

ASJC Scopus subject areas

  • Engineering(all)
  • Environmental Science(all)

Cite this

Esashi, M., & Tanaka, S. (2018). Heterogeneous integration and wafer-level packaging of MEMS. In Mems Packaging (pp. 141-169). World Scientific Publishing Co. Pte Ltd. https://doi.org/10.1142/9789813229365_0008