Heterogeneous integration and wafer-level packaging of MEMS

Masayoshi Esashi, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Citation (Scopus)
Original languageEnglish
Title of host publicationMems Packaging
PublisherWorld Scientific Publishing Co. Pte Ltd
Number of pages29
ISBN (Electronic)9789813229365
ISBN (Print)9789813229358
Publication statusPublished - 2018 Jan 3

ASJC Scopus subject areas

  • Engineering(all)
  • Environmental Science(all)

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