Heterogeneous integration and wafer-level packaging of MEMS

Masayoshi Esashi, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Original language	English
Title of host publication	Mems Packaging
Publisher	World Scientific Publishing Co. Pte Ltd
Pages	141-169
Number of pages	29
ISBN (Electronic)	9789813229365
ISBN (Print)	9789813229358
DOIs	https://doi.org/10.1142/9789813229365_0008
Publication status	Published - 2018 Jan 3

ASJC Scopus subject areas

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