Heterogeneous 3-D integration using self-assembly and electrostatic bonding

Mitsumasa Koyanagi, Takafumi Fukushima, Kang Wook Lee, Tetsu Tanaka

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


To overcome various concerns caused by scaling down the device size in future Large Scale Integrated Circuits (LSIs), it is indispensable to introduce a new concept of heterogeneous 3-D integration in which various kinds of device chips with different sizes, different devices, and different materials are vertically stacked. To achieve such heterogeneous 3-D integration, a key technology of self-assembly and electrostatic bonding has been developed. Exploring new devices for the Internet of Things, we have fabricated several kinds of heterogeneous 3-D LSIs called superchip by stacking compound semiconductor device chip, photonic device chip, and spintronic device chip on CMOS device chips using self-assembly and electrostatic bonding. Furthermore, a new system integration technology using a large-area substrate has been developed to reduce the cost of 2.5-D/3-D system module. A 3-D-stacked image sensor system module for automatic driving vehicle has been fabricated using this technology.

Original languageEnglish
Article number7498659
Pages (from-to)1000-1006
Number of pages7
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number7
Publication statusPublished - 2016 Jul


  • 3-D-LSI
  • 3-D-stacked image sensor
  • 3-D-stacked microprocessor
  • electrostatic bonding
  • heterogeneous integration
  • self-assembly
  • superchip

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering


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