Hetero-integration of β-Ga2O3 and Diamond substrates by hydrophilic bonding technique

Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Hitoshi Umezawa, Koji Tanaka, Toshimitsu Ito, Hideyuki Watanabe, Eiji Higurashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A β-Ga2O3 film was directly bonded on a diamond substrate at 250 ºC under atmospheric conditions. Before bonding, the β-Ga2O3 surface was activated by oxygen plasma irradiation, while the diamond surface was cleaned with H2SO4/H2O2 and NH3/H2O2 mixtures. The β-Ga2O3 and diamond surfaces adhered to one another under atmospheric conditions. By annealing the contacted specimen at 250 ºC, they formed atomic bonds without voids, cracks, or severe crystallinity damages. It is believed that the direct bonding of β-Ga2O3 and diamond can facilitate the ultra-wide bandgap power electronics.

Original languageEnglish
Title of host publicationPRiME 2020
Subtitle of host publicationSemiconductor Wafer Bonding: Science, Technology, and Applications 16
EditorsR. Knechtel, C. S. Tan, T. Suga, H. Baumgart, M. S. Goorsky, F. Fournel, K. D. Hobart, F. Roozeboom
PublisherIOP Publishing Ltd.
Pages17-20
Number of pages4
Edition4
ISBN (Electronic)9781607688990
DOIs
Publication statusPublished - 2020
Externally publishedYes
EventPacific Rim Meeting on Electrochemical and Solid State Science 2020, PRiME 200 - Honolulu, United States
Duration: 2020 Oct 42020 Oct 9

Publication series

NameECS Transactions
Number4
Volume98
ISSN (Print)1938-6737
ISSN (Electronic)1938-5862

Conference

ConferencePacific Rim Meeting on Electrochemical and Solid State Science 2020, PRiME 200
Country/TerritoryUnited States
CityHonolulu
Period20/10/420/10/9

ASJC Scopus subject areas

  • Engineering(all)

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