Hetero-integrated microsystem technology

Shuji Tanaka, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Hetero-integration defined in this paper is the wafer-level integration of MEMS and IC plus the use of functional materials. For this type of hetero-integration, there are technical problems in terms of allowable process temperature, thermal expansion mismatch, material-to-material process compatibility etc. New process technologies to overcome these problems and some hetero-integrated devices are described.

Original languageEnglish
Title of host publicationSociety for Information Display - 18th International Display Workshops 2011, IDW'11
Pages1219-1222
Number of pages4
Publication statusPublished - 2011 Dec 1
Event18th International Display Workshops 2011, IDW 2011 - Nagoya, Japan
Duration: 2011 Dec 72011 Dec 9

Publication series

NameProceedings of the International Display Workshops
Volume2
ISSN (Print)1883-2490

Other

Other18th International Display Workshops 2011, IDW 2011
CountryJapan
CityNagoya
Period11/12/711/12/9

ASJC Scopus subject areas

  • Computer Vision and Pattern Recognition
  • Human-Computer Interaction
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Radiology Nuclear Medicine and imaging

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