Heavy B atomic-layer doping characteristics in Si epitaxial growth on B adsorbed Si(1 0 0) by ultraclean low-pressure CVD system

Hiroki Tanno, Masao Sakuraba, Bernd Tillack, Junichi Murota

Research output: Contribution to journalArticlepeer-review

18 Citations (Scopus)

Abstract

Heavy B atomic-layer doping is performed by B atomic-layer formation on Si(1 0 0) using B2H6 and subsequent Si capping layer deposition using SiH4. By B2H6 exposure on Si(1 0 0) at 180 °C, the B atom amount tends to saturate self-limitedly at around 1.4 × 1015 cm-2 (two atomic layers (AL)). In the case of exposure at 500 °C, the B atom amount increases with time and exceeds two AL. Additionally, B oxide formation by air exposure is observed for 500 °C but not for 180 °C. Therefore, it is suggested that the H adsorption on the B AL is kept at 180 °C and H desorption from the B AL proceeds at 500 °C. It is also found that the SiH4 exposure on the B AL at low temperatures such as 180-300 °C effectively improves the electrical activity of B and suppresses lattice strain generation even with the subsequent Si capping at 500 °C. These results demonstrate that the low temperature reaction of SiH4 as well as B2H6 open the way to extremely heavy B atomic-layer doping.

Original languageEnglish
Pages (from-to)877-879
Number of pages3
JournalSolid-State Electronics
Volume53
Issue number8
DOIs
Publication statusPublished - 2009 Aug

Keywords

  • Atomic-layer doping
  • B
  • BH
  • Chemical vapor deposition (CVD)
  • Epitaxial growth
  • Raman scattering spectroscopy
  • Si
  • SiH
  • X-ray photoelectron spectroscopy (XPS)

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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