Heat-resistant photoresists based on new imaging technique: Reaction development patterning (RDP)

Takafumi Fukushima; Toshiyuki Oyama; Masao Tomoi

doi:10.1117/12.483709

Heat-resistant photoresists based on new imaging technique: Reaction development patterning (RDP)

Takafumi Fukushima, Toshiyuki Oyama, Masao Tomoi

Research output: Contribution to journal › Conference article › peer-review

1 Citation (Scopus)

Abstract

Spin-coated films of non-photosensitive engineering thermoplastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be imaged with near-UV light. The engineering thermoplastics selected for study are commercially available poly(bisphenol A carbonate), polyarylate (U polymer®) and polyetherimide (Ultem®), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution including ethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systems showed good photosensitivity and resolution (line/space 10/10 μm) with about 10-15 μm in thickness.

Original language	English
Pages (from-to)	960-967
Number of pages	8
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	5039 II
DOIs	https://doi.org/10.1117/12.483709
Publication status	Published - 2003 Oct 1
Externally published	Yes
Event	Advances in Resist Technology and Processing XX - Santa Clara, CA, United States Duration: 2003 Feb 24 → 2003 Feb 26

Keywords

Diazonaphthoquinone
Engineering thermoplastics
Heat-resistant photoresists
Positive imaging
Reaction development patterning

ASJC Scopus subject areas

Electrical and Electronic Engineering
Condensed Matter Physics

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10.1117/12.483709

Cite this

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title = "Heat-resistant photoresists based on new imaging technique: Reaction development patterning (RDP)",

abstract = "Spin-coated films of non-photosensitive engineering thermoplastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be imaged with near-UV light. The engineering thermoplastics selected for study are commercially available poly(bisphenol A carbonate), polyarylate (U polymer{\textregistered}) and polyetherimide (Ultem{\textregistered}), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution including ethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systems showed good photosensitivity and resolution (line/space 10/10 μm) with about 10-15 μm in thickness.",

keywords = "Diazonaphthoquinone, Engineering thermoplastics, Heat-resistant photoresists, Positive imaging, Reaction development patterning",

author = "Takafumi Fukushima and Toshiyuki Oyama and Masao Tomoi",

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language = "English",

volume = "5039 II",

pages = "960--967",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

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note = "Advances in Resist Technology and Processing XX ; Conference date: 24-02-2003 Through 26-02-2003",

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T1 - Heat-resistant photoresists based on new imaging technique

T2 - Advances in Resist Technology and Processing XX

AU - Fukushima, Takafumi

AU - Oyama, Toshiyuki

AU - Tomoi, Masao

PY - 2003/10/1

Y1 - 2003/10/1

N2 - Spin-coated films of non-photosensitive engineering thermoplastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be imaged with near-UV light. The engineering thermoplastics selected for study are commercially available poly(bisphenol A carbonate), polyarylate (U polymer®) and polyetherimide (Ultem®), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution including ethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systems showed good photosensitivity and resolution (line/space 10/10 μm) with about 10-15 μm in thickness.

AB - Spin-coated films of non-photosensitive engineering thermoplastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be imaged with near-UV light. The engineering thermoplastics selected for study are commercially available poly(bisphenol A carbonate), polyarylate (U polymer®) and polyetherimide (Ultem®), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution including ethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systems showed good photosensitivity and resolution (line/space 10/10 μm) with about 10-15 μm in thickness.

KW - Diazonaphthoquinone

KW - Engineering thermoplastics

KW - Heat-resistant photoresists

KW - Positive imaging

KW - Reaction development patterning

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DO - 10.1117/12.483709

M3 - Conference article

AN - SCOPUS:0141499349

VL - 5039 II

SP - 960

EP - 967

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

SN - 0277-786X

Y2 - 24 February 2003 through 26 February 2003

ER -

Heat-resistant photoresists based on new imaging technique: Reaction development patterning (RDP)

Abstract

Keywords

ASJC Scopus subject areas

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