Abstract
Spin-coated films of non-photosensitive engineering thermoplastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be imaged with near-UV light. The engineering thermoplastics selected for study are commercially available poly(bisphenol A carbonate), polyarylate (U polymer®) and polyetherimide (Ultem®), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution including ethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systems showed good photosensitivity and resolution (line/space 10/10 μm) with about 10-15 μm in thickness.
Original language | English |
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Pages (from-to) | 960-967 |
Number of pages | 8 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 5039 II |
DOIs | |
Publication status | Published - 2003 Oct 1 |
Externally published | Yes |
Event | Advances in Resist Technology and Processing XX - Santa Clara, CA, United States Duration: 2003 Feb 24 → 2003 Feb 26 |
Keywords
- Diazonaphthoquinone
- Engineering thermoplastics
- Heat-resistant photoresists
- Positive imaging
- Reaction development patterning
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Condensed Matter Physics