Heat-resistant photoresists based on new imaging technique: Reaction development patterning (RDP)

Takafumi Fukushima, Toshiyuki Oyama, Masao Tomoi

Research output: Contribution to journalConference article

1 Citation (Scopus)

Abstract

Spin-coated films of non-photosensitive engineering thermoplastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be imaged with near-UV light. The engineering thermoplastics selected for study are commercially available poly(bisphenol A carbonate), polyarylate (U polymer®) and polyetherimide (Ultem®), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution including ethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systems showed good photosensitivity and resolution (line/space 10/10 μm) with about 10-15 μm in thickness.

Original languageEnglish
Pages (from-to)960-967
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5039 II
DOIs
Publication statusPublished - 2003 Oct 1
Externally publishedYes
EventAdvances in Resist Technology and Processing XX - Santa Clara, CA, United States
Duration: 2003 Feb 242003 Feb 26

Keywords

  • Diazonaphthoquinone
  • Engineering thermoplastics
  • Heat-resistant photoresists
  • Positive imaging
  • Reaction development patterning

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

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