Heat-resistant photoresists based on new imaging technique: Reaction development patterning

Takafumi Fukushima, Yukiko Kawakami, Akira Kitamura, Toshiyuki Oyama, Masao Tomoi

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)

Abstract

Spin-coated films of nonphotosensitive engineering thermo-plastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be clearly imaged with near-UV light. The selected engineering thermoplastics are commercially available poly(bisphenol A carbonate), polyarylate (U polymer®) and polyetherimide (Ultem®), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution including ethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systems shows good photosensitivity and resolution (line/space 10/10 μm) with about 10 to 15 μm in thickness. Gel-permiation chromatography (GPC) and 1H-NMR measurements that can give information on the structure of components dissolved from the irradiated regions are carried out to make clear the imaging mechanism, which we call reaction development patterning (RDP). RDP-based photosensitive polymers showed high heat resistance up to their glass transition temperature (Tg) or above.

Original languageEnglish
Pages (from-to)159-167
Number of pages9
JournalJournal of Microlithography, Microfabrication and Microsystems
Volume3
Issue number1
DOIs
Publication statusPublished - 2004 Jan 1
Externally publishedYes

Keywords

  • Diazonaphthoquinone
  • Engineering thermoplastics
  • Heat-resistant photoresists
  • Positive imaging
  • Reaction development patterning

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Electrical and Electronic Engineering

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