Handbook of 3D Integration

Philip Garrou, Mitsumasa Koyanagi, Peter Ramm

Research output: Chapter in Book/Report/Conference proceedingChapter

23 Citations (Scopus)

Abstract

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

Original languageEnglish
Title of host publication3D Process Technology
PublisherWiley-Blackwell
Pages1-451
Number of pages451
Volume3
ISBN (Electronic)9783527670109
ISBN (Print)9783527334667
DOIs
Publication statusPublished - 2014 Jul 21

ASJC Scopus subject areas

  • Engineering(all)
  • Biochemistry, Genetics and Molecular Biology(all)
  • Chemical Engineering(all)
  • Materials Science(all)

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