Grain boundary sliding induced by lattice dislocation activity during ambient temperature creep in h.c.p. metals

T. Matsunaga, T. Kameyama, E. Sato

Research output: Contribution to journalConference articlepeer-review

6 Citations (Scopus)

Abstract

Hexagonal close-packed metals and alloys show significant creep behavior at ambient temperature, even below their 0.2% proof stresses. That creep behavior arises from straightly aligned dislocation arrays in a single slip system without any dislocation cuttings. These dislocation arrays pile up at grain boundary (GB) because of violation of von Mises' condition. Therefore, GB sliding must accommodate the piled-up dislocations. In this study, electron back scatter diffraction (EBSD) analyses and atomic force microscope (AFM) observations revealed an accommodation mechanism in ambient temperature creep region. Lattice rotation occurred near GB during creep, as revealed by EBSD analyses, indicating the pile up of lattice dislocations there. GB sliding during creep was revealed by AFM observations.

Original languageEnglish
Article number012014
JournalIOP Conference Series: Materials Science and Engineering
Volume3
DOIs
Publication statusPublished - 2009
Externally publishedYes
Event3rd International Conference on the Fundamentals of Plastic Deformation, DISLOCATIONS 2008 - Hong Kong, Hong Kong
Duration: 2008 Oct 132008 Oct 17

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)

Fingerprint Dive into the research topics of 'Grain boundary sliding induced by lattice dislocation activity during ambient temperature creep in h.c.p. metals'. Together they form a unique fingerprint.

Cite this