Grain boundary sliding during low temperature creep of ultrafine and coarse grained aluminum

Eiichi Sato, Kaoru Ishiwata, Tetsuya Matsunaga

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Creep tests were conducted at low temperatures for ultrafine-grained aluminum (UFG Al) fabricated by accumulative roll bonding. The samples showed remarkable creep behavior with a stress exponent of about three, a grain-size exponent of almost zero, and a low apparent activation energy of 20 kJ/mol. This creep behavior is similar to that of low-temperature creep of coarsegrained (CG) Al, though UFG Al shows creep under stresses below its 0.2% proof stress while CG Al show it under stresses above that.

Original languageEnglish
Title of host publicationSuperplasticity in Advanced Materials - ICSAM 2012
PublisherTrans Tech Publications Ltd
Pages17-21
Number of pages5
ISBN (Print)9783037855539
DOIs
Publication statusPublished - 2013 Jan 1
Externally publishedYes
Event11th International Conference on Superplasticity in Advanced Materials, ICSAM 2012 - Albi, France
Duration: 2012 Jul 32012 Jul 5

Publication series

NameMaterials Science Forum
Volume735
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other11th International Conference on Superplasticity in Advanced Materials, ICSAM 2012
CountryFrance
CityAlbi
Period12/7/312/7/5

Keywords

  • Accumulative roll bonding
  • Low temperature creep
  • Ultrafine grain

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Sato, E., Ishiwata, K., & Matsunaga, T. (2013). Grain boundary sliding during low temperature creep of ultrafine and coarse grained aluminum. In Superplasticity in Advanced Materials - ICSAM 2012 (pp. 17-21). (Materials Science Forum; Vol. 735). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.735.17