Grain boundary sliding below ambient temperature in H.C.P. metals

Eiichi Sato, Tetsuya Matsunaga

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Hexagonal close-packed metals and alloys show significant creep behavior with extremely low activation energies at and below ambient temperature even below their 0.2% proof stresses. It is caused by straightly-aligned dislocation arrays in a single slip system without any dislocation cuttings. These dislocation arrays should, then, pile up at grain boundary (GB) because of violation of von Mises' condition in H.C.P. structure. The piled-up dislocations have to be accommodated by GB sliding. Electron back scatter diffraction (EBSD) analyses and atomic force microscope (AFM) observations were performed to reveal the mechanism of GB sliding below ambient temperature in H.C.P. metals as an accommodation mechanism of ambient temperature creep. EBSD analyses revealed that crystal lattice rotated near GB, which indicates the pile up of lattice dislocations at GB. AFM observation showed a step caused by GB sliding. GB sliding below ambient temperature in H.C.P. metals are considered to compensate the incompatibility between neighboring grains by dislocation slip, which is called slip induced GB sliding.

Original languageEnglish
Title of host publicationSuperplasticity in Advanced Materials - ICSAM 2009
PublisherTrans Tech Publications Ltd
Pages299-303
Number of pages5
ISBN (Print)9780878492831
DOIs
Publication statusPublished - 2010
Externally publishedYes
Event10th International Conference on Superplasticity in Advanced Materials, ICSAM 2009 - Seattle, WA, United States
Duration: 2009 Jun 292009 Jul 2

Publication series

NameKey Engineering Materials
Volume433
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Other

Other10th International Conference on Superplasticity in Advanced Materials, ICSAM 2009
Country/TerritoryUnited States
CitySeattle, WA
Period09/6/2909/7/2

Keywords

  • Ambient temperature creep
  • Dislocation
  • Grain boundary sliding
  • H.c.p. metal

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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