Glyoxylic acid as reducing agent for electroless copper deposition on cobalt liner

Fumihiro Inoue, Harold Philipsen, Marleen H. Van Der Veen, Stefaan Van Huylenbroeck, Silvia Armini, Herbert Struyf, Shoso Shingubara, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Electroless deposition of Cu was investigated on thin Co layer for through Si via with high aspect ratio structure. The electroless deposition bath was optimized for minimizing Co corrosion during Cu nucleation by using electrochemical analysis. Glyoxylic acid, which is known as non-toxic reducing agent for electroless Cu deposition, showed anodic oxidation on Co, which did not appear for the case of formaldehyde. Furthermore, ratio of complexing agent and Cu ion also impacted Co corrosion; free complexing agent in the electroless deposition bath accelerated corrosion of Co. The optimized electroless bath which contained glyoxylic acid as reducing agent and non-free EDTA performed in 3 μm × 50 μm TSV, the electroless deposited Cu layer could serve as a seed layer for TSV filling by electrodeposition. The electroless Cu layer was continuously deposited without missing of continuity of Co layer even close to the bottom of TSV.

Original languageEnglish
Title of host publicationProcessing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
EditorsD. P. Barkey, W. P. Dow, K. Kondo, M. Koyanagi, S. Shingubara, F. Roozeboom, P. Ramm, R. Akolkar, M. Hayase, S. Mathad
PublisherElectrochemical Society Inc.
Pages63-75
Number of pages13
Edition40
ISBN (Electronic)9781607685395
DOIs
Publication statusPublished - 2015 Jan 1
EventSymposium on Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 - 2014 ECS and SMEQ Joint International Meeting - Cancun, Mexico
Duration: 2014 Oct 52014 Oct 9

Publication series

NameECS Transactions
Number40
Volume64
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

OtherSymposium on Processing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6 - 2014 ECS and SMEQ Joint International Meeting
CountryMexico
CityCancun
Period14/10/514/10/9

ASJC Scopus subject areas

  • Engineering(all)

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