Present progress in developments of glassy alloy composites for bit-patterned-media and non-equilibrium Cu-based alloys for conductive materials of electrical connectors are reviewed. It is proven that the imprinting of the Pd-based glassy alloy thin film is favorable for the formation of nano-structured devices. Detailed imprinted morphologies formed by different imprinting conditions were examined. In addition, technology of large area imprinting up to 2.5 inches area has been successfully developed and it is now available for production. These technological developments will be utilized for next generation bit-patterned-media with high data density. A newly developed non-equilibrium Cu-Zr-Ag alloy was prepared into sheet form by the combination of casting, cold rolling and annealing. The alloy sheet exhibited high tensile strength of exceeding 1500 MPa and good electrical conductivity of 30% IACS. However, bending ductility should be improved for the actual production of connector. Through the several examinations, remaining issues that should be solved are discussed in the framework of industrialization and commercialization. These obtained results suggest that the glassy alloy composite or non-equilibrium alloy designed by the glass-forming rules have a great potential to develop innovative products in the near future.