Glass reflow process and its applications

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work presents the glass reflow process for microsystems. In this process, glass compounded silicon structures are achieved with the help of vacuum cavities under a high temperature. Three applications employing the glass reflow process, through-wafer interconnects, thermal isolation, and optical window, have been proposed and investigated.

Original languageEnglish
Title of host publication2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages260-264
Number of pages5
ISBN (Electronic)9781509019472
DOIs
Publication statusPublished - 2016 Nov 28
Event11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 - Sendai, Japan
Duration: 2016 Apr 172016 Apr 20

Publication series

Name2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016

Other

Other11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
CountryJapan
CitySendai
Period16/4/1716/4/20

Keywords

  • Glass capillary optical window
  • Glass reflow process
  • thermal isolation
  • through-wafer interconnects

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Van Toan, N., Sangu, S., & Ono, T. (2016). Glass reflow process and its applications. In 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 (pp. 260-264). [7758246] (2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2016.7758246