@inproceedings{12869ab5aba6448a80b1b80cbd661489,
title = "Gas absorption in package using Au/Pt/Ti bonding layer",
abstract = "A packaged environment was fabricated by bonding substrates with the Au/Pt/Ti layers. By annealing the package at 450 °C, Ti diffused through the Pt and Au layers and reacted with gas molecules at the inner surface. These results suggested that a cap wafer metalized the Au/Pt/Ti layer can form hermetic sealing with a device substrate and also absorb the residual gas in the package by the high-temperature annealing. It is believed the proposed technique would contribute to simplified vacuum packaging processes because the Au/Pt/Ti layers can be utilized as the bonding and gettering films.",
author = "Takashi Matsumae and Shingo Kariya and Yuichi Kurashima and Hideki Takagi and Masanori Hayase and Eiji Higurashi",
note = "Funding Information: A part of this work was supported by JSPS KAKENHI Grant Number 19H02045. Publisher Copyright: {\textcopyright} The Electrochemical Society; Pacific Rim Meeting on Electrochemical and Solid State Science 2020, PRiME 200 ; Conference date: 04-10-2020 Through 09-10-2020",
year = "2020",
doi = "10.1149/09804.0211ecst",
language = "English",
series = "ECS Transactions",
publisher = "IOP Publishing Ltd.",
number = "4",
pages = "211--215",
editor = "R. Knechtel and Tan, {C. S.} and T. Suga and H. Baumgart and Goorsky, {M. S.} and F. Fournel and Hobart, {K. D.} and F. Roozeboom",
booktitle = "PRiME 2020",
address = "United Kingdom",
edition = "4",
}