Future system-on-silicon LSI chips

Mitsumasa Koyanagi, Hiroyuki Kurino, Kang Wook Lee, Katsuyuki Sakuma, Nobuaki Miyakawa, Hikotaro Itani

Research output: Contribution to journalArticlepeer-review

313 Citations (Scopus)

Abstract

By vertically stacking and gluing several LSI wafers together, we have created a new 3D-integration technology that also furthers chip-on-chip packaging technology.

Original languageEnglish
Pages (from-to)17-21
Number of pages5
JournalIEEE Micro
Volume18
Issue number4
DOIs
Publication statusPublished - 1998 Jul

ASJC Scopus subject areas

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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