Fundamental investigation for NDE of adhesive strength of diamond film

Masumi Saka, K. Hoshikawa, H. Abe, H. Fujita, Y. Izumi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

NDE of the adhesive strength of diamond film to Si substrate is treated. Two types of model specimens are prepared and offered for observation and experimental analysis of the reflected wave. One has the diamond film adhered strongly to the substrate and another has a delaminated film and hence a thin layer of water exists between the film and the substrate. From spectra obtained by fast Fourier transform, the characteristic is found for the delaminated specimen that the spectrum oscillates. This phenomenon is explained theoretically by considering thin thickness of the film and existence of the oscillation is proved to be useful for detection of the delamination.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, EEP
PublisherPubl by ASME
Pages947-950
Number of pages4
ISBN (Print)0791807665
Publication statusPublished - 1992 Dec 1
EventProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA
Duration: 1992 Apr 91992 Apr 12

Publication series

NameAmerican Society of Mechanical Engineers, EEP
Volume2

Other

OtherProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
CityMilpitas, CA, USA
Period92/4/992/4/12

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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