Fundamental investigation for NDE of adhesive strength of diamond film

M. Saka; K. Hoshikawa; H. Abe; H. Fujita; Y. Izumi

Fundamental investigation for NDE of adhesive strength of diamond film

M. Saka, K. Hoshikawa, H. Abe, H. Fujita, Y. Izumi

ENG - Finemechanics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

NDE of the adhesive strength of diamond film to Si substrate is treated. Two types of model specimens are prepared and offered for observation and experimental analysis of the reflected wave. One has the diamond film adhered strongly to the substrate and another has a delaminated film and hence a thin layer of water exists between the film and the substrate. From spectra obtained by fast Fourier transform, the characteristic is found for the delaminated specimen that the spectrum oscillates. This phenomenon is explained theoretically by considering thin thickness of the film and existence of the oscillation is proved to be useful for detection of the delamination.

Original language	English
Title of host publication	American Society of Mechanical Engineers, EEP
Publisher	Publ by ASME
Pages	947-950
Number of pages	4
ISBN (Print)	0791807665
Publication status	Published - 1992
Event	Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA Duration: 1992 Apr 9 → 1992 Apr 12

Publication series

Name	American Society of Mechanical Engineers, EEP
Volume	2

Other

Other	Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
City	Milpitas, CA, USA
Period	92/4/9 → 92/4/12

ASJC Scopus subject areas

Electrical and Electronic Engineering
Mechanical Engineering

Cite this

Saka, M, Hoshikawa, K, Abe, H, Fujita, H & Izumi, Y 1992, Fundamental investigation for NDE of adhesive strength of diamond film. in American Society of Mechanical Engineers, EEP. American Society of Mechanical Engineers, EEP, vol. 2, Publ by ASME, pp. 947-950, Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2), Milpitas, CA, USA, 92/4/9.

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abstract = "NDE of the adhesive strength of diamond film to Si substrate is treated. Two types of model specimens are prepared and offered for observation and experimental analysis of the reflected wave. One has the diamond film adhered strongly to the substrate and another has a delaminated film and hence a thin layer of water exists between the film and the substrate. From spectra obtained by fast Fourier transform, the characteristic is found for the delaminated specimen that the spectrum oscillates. This phenomenon is explained theoretically by considering thin thickness of the film and existence of the oscillation is proved to be useful for detection of the delamination.",

author = "M. Saka and K. Hoshikawa and H. Abe and H. Fujita and Y. Izumi",

year = "1992",

language = "English",

isbn = "0791807665",

series = "American Society of Mechanical Engineers, EEP",

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pages = "947--950",

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note = "Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) ; Conference date: 09-04-1992 Through 12-04-1992",

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TY - GEN

T1 - Fundamental investigation for NDE of adhesive strength of diamond film

AU - Saka, M.

AU - Hoshikawa, K.

AU - Abe, H.

AU - Fujita, H.

AU - Izumi, Y.

PY - 1992

Y1 - 1992

N2 - NDE of the adhesive strength of diamond film to Si substrate is treated. Two types of model specimens are prepared and offered for observation and experimental analysis of the reflected wave. One has the diamond film adhered strongly to the substrate and another has a delaminated film and hence a thin layer of water exists between the film and the substrate. From spectra obtained by fast Fourier transform, the characteristic is found for the delaminated specimen that the spectrum oscillates. This phenomenon is explained theoretically by considering thin thickness of the film and existence of the oscillation is proved to be useful for detection of the delamination.

AB - NDE of the adhesive strength of diamond film to Si substrate is treated. Two types of model specimens are prepared and offered for observation and experimental analysis of the reflected wave. One has the diamond film adhered strongly to the substrate and another has a delaminated film and hence a thin layer of water exists between the film and the substrate. From spectra obtained by fast Fourier transform, the characteristic is found for the delaminated specimen that the spectrum oscillates. This phenomenon is explained theoretically by considering thin thickness of the film and existence of the oscillation is proved to be useful for detection of the delamination.

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M3 - Conference contribution

AN - SCOPUS:0027072358

SN - 0791807665

T3 - American Society of Mechanical Engineers, EEP

SP - 947

EP - 950

BT - American Society of Mechanical Engineers, EEP

PB - Publ by ASME

T2 - Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)

Y2 - 9 April 1992 through 12 April 1992

ER -

Fundamental investigation for NDE of adhesive strength of diamond film

Abstract

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