The basic function and performance of optically coupled three-dimensional common memory (3D-OCC memory) are evaluated using an optical-electrical circuit simulator. The 3D-OCC memory is a new shared memory with 3D LSI structure and optical interconnection which has been proposed for a high-performance parallel processing system. It is confirmed in the simulation that a very high data transfer speed of 128 Gbits/sec, can be achieved between memory layers in 3D-OCC memory. New microbonding and wafer bonding technologies have been developed to fabricate the 3D-OCC memory test chip. It is demonstrated using the fabricated test chip that the 3D-OCC can be successfully operated.
|Number of pages||12|
|Journal||Optoelectronics - Devices and Technologies|
|Publication status||Published - 1994 Mar 1|
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