Fundamental characteristics of optically coupled three-dimensional common memory

Mitsumasa Koyanagi, Koji Miyake, Hirokazu Kurotaki, Shin Yokoyama, Yasuhiro Horiike, Masataka Hirose

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The basic function and performance of optically coupled three-dimensional common memory (3D-OCC memory) are evaluated using an optical-electrical circuit simulator. The 3D-OCC memory is a new shared memory with 3D LSI structure and optical interconnection which has been proposed for a high-performance parallel processing system. It is confirmed in the simulation that a very high data transfer speed of 128 Gbits/sec, can be achieved between memory layers in 3D-OCC memory. New microbonding and wafer bonding technologies have been developed to fabricate the 3D-OCC memory test chip. It is demonstrated using the fabricated test chip that the 3D-OCC can be successfully operated.

Original languageEnglish
Pages (from-to)119-130
Number of pages12
JournalOptoelectronics - Devices and Technologies
Volume9
Issue number1
Publication statusPublished - 1994 Mar 1

ASJC Scopus subject areas

  • Engineering(all)

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