Fully-integrated, fully-differential 3-axis tactile sensor on platform LSI with TSV-based surface-mountable structure

Yoshiyuki Hata, Yukio Suzuki, Masanori Muroyama, Takahiro Nakayama, Yutaka Nonomura, Rakesh Chand, Hideki Hirano, Yoshiteru Omura, Motohiro Fujiyoshi, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The present paper reports a 2.8-mm-square surface-mountable MEMS-on-LSI integrated 3-axis tactile sensor for robot applications, which incorporates sensing and signal processing in a single chip. The MEMS part has a quad-seesaw-electrode structure for fully-differential capacitive 3-axis force sensing. The LSI is an original sensor platform LSI equipped with deep annular-type through silicon vias (TSVs). A multi-project LSI wafer was processed after fabrication in an LSI foundry. The MEMS part and the LSI part were integrated by Au-Au thermocompression bonding. The output is a digital packet and is transferred through the TSV and a bus line. A working test successfully demonstrated the fully-differential capacitive 3-axis force sensing of the fully-integrated tactile sensor.

Original languageEnglish
Title of host publicationTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages500-503
Number of pages4
ISBN (Electronic)9781538627310
DOIs
Publication statusPublished - 2017 Jul 26
Event19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan, Province of China
Duration: 2017 Jun 182017 Jun 22

Publication series

NameTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
CountryTaiwan, Province of China
CityKaohsiung
Period17/6/1817/6/22

Keywords

  • 3-axis force sensing
  • MEMS-on-LSI integration
  • Quad-seesaw-electrode structure
  • Sensor platform LSI
  • Tactile sensor
  • Through silicon via

ASJC Scopus subject areas

  • Chemical Health and Safety
  • Instrumentation
  • Electrical and Electronic Engineering

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