Fully CMOS-Compatible Wafer Bonding Based on Press Marking Using Thick Electroplated Aluminum

Muhammad Salman Al Farisi, Takashiro Tsukamoto, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Aluminum has a great potential as a wafer bonding material due to its inherent compatibility with the complimentary metal oxide semiconductor (CMOS) processes. In this study, a novel wafer bonding technique for heterogeneous integration using electroplated Al bonding frame is demonstrated for the first time. The Al frames were deposited by electroplating from a chloroaluminate ionic liquid. The electroplated Al bonding frames were mechanically deformed by the groove structures on the counter wafer, i.e. press marking. Such a large mechanical deformation enabled the wafer bonding at a temperature of as low as 250°C, which is the lowest value that has ever been reported for the Al bonding. The influence of the bonding temperature to the quality of the bonded substrates were evaluated. The bonding shear strength of 8-100 MPa was obtained, which is in par with the other established techniques.

Original languageEnglish
Title of host publication21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1138-1141
Number of pages4
ISBN (Electronic)9781665412674
DOIs
Publication statusPublished - 2021 Jun 20
Event21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021 - Virtual, Online, United States
Duration: 2021 Jun 202021 Jun 25

Publication series

Name21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021

Conference

Conference21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
Country/TerritoryUnited States
CityVirtual, Online
Period21/6/2021/6/25

Keywords

  • aluminum
  • electroplating
  • press marking
  • Wafer bonding

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Control and Optimization
  • Instrumentation

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