FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display

Yuki Susumago; Tomo Odashima; Masatsugu Ichikawa; Hiroki Hanaoka; Hisashi Kino; Tetsu Tanaka; Takafumi Fukushima

doi:10.1109/ECTC32696.2021.00017

FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display

Yuki Susumago, Tomo Odashima, Masatsugu Ichikawa, Hiroki Hanaoka, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

This paper deals with a flexible 3D-IC system fabrication methodology. Mini-LEDs and 3D-IC chiplets divided from a large 3D-IC with Cu-TSVs are embedded in an elastomer PDMS based on die-first FOWLP for heterogeneously integrating them into Smart Skin Display as a biomedical/wearable FHE (flexible hybrid electronics). We address a serious die-shift issue for the tiny chips in die-first FOWLP by using a new anchoring layer technique to drastically reduce the shift within 2.7 μm including assembly positioning errors. The mechanical/electrical properties of the flexible array of 3D-IC chiplets are characterized before and after repeated bending with a curvature radius of 10 mm. In addition, stress neutral axes are designed to stably endure bending cycle applicable to the biomedical/wearable FHE with multi-level metallization.

Original language	English
Title of host publication	Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	34-39
Number of pages	6
ISBN (Electronic)	9780738145235
DOIs	https://doi.org/10.1109/ECTC32696.2021.00017
Publication status	Published - 2021
Event	71st IEEE Electronic Components and Technology Conference, ECTC 2021 - Virtual, Online, United States Duration: 2021 Jun 1 → 2021 Jul 4

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2021-June
ISSN (Print)	0569-5503

Conference

Conference	71st IEEE Electronic Components and Technology Conference, ECTC 2021
Country/Territory	United States
City	Virtual, Online
Period	21/6/1 → 21/7/4

Keywords

3D-IC/TSV
Chiplets
Die-first FOWLP
Flexible Hybrid Electronics (FHE)
Micro-LED
PDMS

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC32696.2021.00017

Cite this

Susumago, Y., Odashima, T., Ichikawa, M., Hanaoka, H., Kino, H., Tanaka, T., & Fukushima, T. (2021). FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display. In Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021 (pp. 34-39). (Proceedings - Electronic Components and Technology Conference; Vol. 2021-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC32696.2021.00017

FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display. / Susumago, Yuki; Odashima, Tomo; Ichikawa, Masatsugu et al.

Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 34-39 (Proceedings - Electronic Components and Technology Conference; Vol. 2021-June).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Susumago, Y, Odashima, T, Ichikawa, M, Hanaoka, H, Kino, H , Tanaka, T & Fukushima, T 2021, FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display. in Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Proceedings - Electronic Components and Technology Conference, vol. 2021-June, Institute of Electrical and Electronics Engineers Inc., pp. 34-39, 71st IEEE Electronic Components and Technology Conference, ECTC 2021, Virtual, Online, United States, 21/6/1. https://doi.org/10.1109/ECTC32696.2021.00017

Susumago Y, Odashima T, Ichikawa M, Hanaoka H, Kino H , Tanaka T et al. FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display. In Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 34-39. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC32696.2021.00017

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title = "FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display",

abstract = "This paper deals with a flexible 3D-IC system fabrication methodology. Mini-LEDs and 3D-IC chiplets divided from a large 3D-IC with Cu-TSVs are embedded in an elastomer PDMS based on die-first FOWLP for heterogeneously integrating them into Smart Skin Display as a biomedical/wearable FHE (flexible hybrid electronics). We address a serious die-shift issue for the tiny chips in die-first FOWLP by using a new anchoring layer technique to drastically reduce the shift within 2.7 μm including assembly positioning errors. The mechanical/electrical properties of the flexible array of 3D-IC chiplets are characterized before and after repeated bending with a curvature radius of 10 mm. In addition, stress neutral axes are designed to stably endure bending cycle applicable to the biomedical/wearable FHE with multi-level metallization.",

keywords = "3D-IC/TSV, Chiplets, Die-first FOWLP, Flexible Hybrid Electronics (FHE), Micro-LED, PDMS",

author = "Yuki Susumago and Tomo Odashima and Masatsugu Ichikawa and Hiroki Hanaoka and Hisashi Kino and Tetsu Tanaka and Takafumi Fukushima",

note = "Funding Information: This work was performed in the Micro/Nano-machining research and education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University. This work was fully supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 18K18841 of Challenging Research (Exploratory). This work was also partially supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 19KK0101 of the Promotion of Joint International Research (Fostering Joint International Research (B)). Publisher Copyright: {\textcopyright} 2021 IEEE; 71st IEEE Electronic Components and Technology Conference, ECTC 2021 ; Conference date: 01-06-2021 Through 04-07-2021",

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language = "English",

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AU - Tanaka, Tetsu

AU - Fukushima, Takafumi

N1 - Funding Information: This work was performed in the Micro/Nano-machining research and education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University. This work was fully supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 18K18841 of Challenging Research (Exploratory). This work was also partially supported by JSPS KAKENHI (Grants-in-Aid for Scientific Research) Grant Number 19KK0101 of the Promotion of Joint International Research (Fostering Joint International Research (B)). Publisher Copyright: © 2021 IEEE

PY - 2021

Y1 - 2021

N2 - This paper deals with a flexible 3D-IC system fabrication methodology. Mini-LEDs and 3D-IC chiplets divided from a large 3D-IC with Cu-TSVs are embedded in an elastomer PDMS based on die-first FOWLP for heterogeneously integrating them into Smart Skin Display as a biomedical/wearable FHE (flexible hybrid electronics). We address a serious die-shift issue for the tiny chips in die-first FOWLP by using a new anchoring layer technique to drastically reduce the shift within 2.7 μm including assembly positioning errors. The mechanical/electrical properties of the flexible array of 3D-IC chiplets are characterized before and after repeated bending with a curvature radius of 10 mm. In addition, stress neutral axes are designed to stably endure bending cycle applicable to the biomedical/wearable FHE with multi-level metallization.

AB - This paper deals with a flexible 3D-IC system fabrication methodology. Mini-LEDs and 3D-IC chiplets divided from a large 3D-IC with Cu-TSVs are embedded in an elastomer PDMS based on die-first FOWLP for heterogeneously integrating them into Smart Skin Display as a biomedical/wearable FHE (flexible hybrid electronics). We address a serious die-shift issue for the tiny chips in die-first FOWLP by using a new anchoring layer technique to drastically reduce the shift within 2.7 μm including assembly positioning errors. The mechanical/electrical properties of the flexible array of 3D-IC chiplets are characterized before and after repeated bending with a curvature radius of 10 mm. In addition, stress neutral axes are designed to stably endure bending cycle applicable to the biomedical/wearable FHE with multi-level metallization.

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FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display

Abstract

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Conference

Keywords

ASJC Scopus subject areas

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