Formation of slit-like voids at trench corners of damascene Cu interconnects

Atsuko Sekiguchi, Junichi Koike, Kouichi Maruyama

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

Stress voiding was investigated in damascene Cu lines embedded in Ta/TaN/SiO2/Si. Microstructure was observed before and after heat treatment at 723 K using a focused ion beam (FIB) technique. The distribution of thermal stress was calculated using a three-dimensional finite element method (FEM). FIB observation revealed that slit-like voids were formed at trench shoulders both before and after heat treatment. FEM calculation indicated that a large shear stress concentration occurred at the voided sites. The coincidence between the FIB observation and the FEM calculation suggests that the slit-like voids were formed by shear-mode delamination of Cu from the Ta/TaN barrier layer.

Original languageEnglish
Pages (from-to)1633-1637
Number of pages5
JournalMaterials Transactions
Volume43
Issue number7
DOIs
Publication statusPublished - 2002 Jul
Externally publishedYes

Keywords

  • Copper
  • Interconnect
  • Interface
  • Stress
  • Void

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Formation of slit-like voids at trench corners of damascene Cu interconnects'. Together they form a unique fingerprint.

  • Cite this