Formation of copper micropatterns by laser direct writing using copper nanoparticle ink

Akira Watanabe, Jinguang Cai, Gang Qin, Lidan Fan

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)


    The 2D and 3D laser direct writing using Cu nanoparticle ink were studied using a compact blue-violet semiconductor laser. The laser direct writing based on a motion controller and G-code language program on PC enabled to prepare various kinds of shaped Cu grids which can be easily designed on-demand. A Cu grid pattern was prepared on a flexible and transparent polymer substrate and applied to a stress sensor. A star-shaped grid was fabricated a polymer substrate and the performance as a stress sensor for detecting the motion of human hand devises was demonstrated toward wearable electronics. In the preliminary 3D study, we have employed the layer-by-layer formation of a 3D structure, where cycle of the spin-coating of a metal nanoparticle ink and the laser direct writing were repeated. The 3D microstructures prepared by the 3D laser direct writing using Ag and Cu nanoparticle inks suggested the possibility of a 3D interconnection.

    Original languageEnglish
    Title of host publicationLaser-Based Micro-and Nanoprocessing X
    EditorsCraig B. Arnold, Kunihiko Washio, Udo Klotzbach
    ISBN (Electronic)9781628419719
    Publication statusPublished - 2016
    EventLaser-Based Micro-and Nanoprocessing X - San Francisco, United States
    Duration: 2016 Feb 162016 Feb 18

    Publication series

    NameProceedings of SPIE - The International Society for Optical Engineering
    ISSN (Print)0277-786X
    ISSN (Electronic)1996-756X


    OtherLaser-Based Micro-and Nanoprocessing X
    Country/TerritoryUnited States
    CitySan Francisco


    • 3D laser direct writing
    • 3D micro structure
    • copper grid
    • copper micropattern
    • copper nanoparticle ink
    • flexible and printed electronics
    • flexible polymer substrate
    • laser direct writing
    • stress sensor

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Computer Science Applications
    • Applied Mathematics
    • Electrical and Electronic Engineering


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