Formation of copper micropatterns by laser direct writing using copper nanoparticle ink

Akira Watanabe, Jinguang Cai, Gang Qin, Lidan Fan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)


The 2D and 3D laser direct writing using Cu nanoparticle ink were studied using a compact blue-violet semiconductor laser. The laser direct writing based on a motion controller and G-code language program on PC enabled to prepare various kinds of shaped Cu grids which can be easily designed on-demand. A Cu grid pattern was prepared on a flexible and transparent polymer substrate and applied to a stress sensor. A star-shaped grid was fabricated a polymer substrate and the performance as a stress sensor for detecting the motion of human hand devises was demonstrated toward wearable electronics. In the preliminary 3D study, we have employed the layer-by-layer formation of a 3D structure, where cycle of the spin-coating of a metal nanoparticle ink and the laser direct writing were repeated. The 3D microstructures prepared by the 3D laser direct writing using Ag and Cu nanoparticle inks suggested the possibility of a 3D interconnection.

Original languageEnglish
Title of host publicationLaser-Based Micro-and Nanoprocessing X
EditorsCraig B. Arnold, Kunihiko Washio, Udo Klotzbach
ISBN (Electronic)9781628419719
Publication statusPublished - 2016
EventLaser-Based Micro-and Nanoprocessing X - San Francisco, United States
Duration: 2016 Feb 162016 Feb 18

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X


OtherLaser-Based Micro-and Nanoprocessing X
CountryUnited States
CitySan Francisco


  • 3D laser direct writing
  • 3D micro structure
  • copper grid
  • copper micropattern
  • copper nanoparticle ink
  • flexible and printed electronics
  • flexible polymer substrate
  • laser direct writing
  • stress sensor

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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