Formation of closely packed Cu nanoparticle films by capillary immersion force for preparing low-resistivity Cu films at low temperature

Shun Yokoyama, Kenichi Motomiya, Hideyuki Takahashi, Kazuyuki Tohji

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Abstract

Films made of closely packed Cu nanoparticles (NPs) were obtained by drop casting Cu NP inks. The capillary immersion force exerted during the drying of the inks caused the Cu NPs to attract each other, resulting in closely packed Cu NP films. The apparent density of the films was found to depend on the type of solvent in the ink because the capillary immersion force is affected by the solvent surface tension and dispersibility of Cu NPs in the solvent. The closely packed particulate structure facilitated the sintering of Cu NPs even at low temperature, leading to low-resistivity Cu films. The sintering was also enhanced with a decrease in the size of NPs used. We demonstrated that a closely packed particulate structure using Cu NPs with a mean diameter 61.7 nm showed lower resistivity (7.6 μΩ cm) than a traditionally made Cu NP film (162 μΩ cm) after heat treatment.

Original languageEnglish
Article number326
JournalJournal of Nanoparticle Research
Volume18
Issue number11
DOIs
Publication statusPublished - 2016 Nov 1

Keywords

  • Capillary force
  • Copper
  • Low resistivity
  • Nanoparticle films
  • Sintering

ASJC Scopus subject areas

  • Bioengineering
  • Chemistry(all)
  • Atomic and Molecular Physics, and Optics
  • Modelling and Simulation
  • Materials Science(all)
  • Condensed Matter Physics

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