Formation of Al-Cr-N films by a DC reactive sputtering method and evaluation of their properties

Y. Ide, T. Nakamura, K. Kishitake

Research output: Chapter in Book/Report/Conference proceedingConference contribution

17 Citations (Scopus)

Abstract

It is expected that an Al-Cr-N composite nitride film may have a higher resistance to oxidation at elevated temperatures than the well-known Ti-Al-N films. The formation conditions of Al-Cr-N films by a dc reactive sputtering method and their properties were studied in this study. The films characterized with respect to their high temperature properties such as chemical composition, crystal structure, microhardness, wear and friction. The crystal structure of the Al-Cr-N films changed from hexagonal phase to cubic phase with an increase in Cr content in the films. The resistivity to thermal oxidation of the Al-Cr-N films is superior to that of usual Ti-Al-N films. A half of the friction coefficient in the Al-Cr-N film was obtained comparing with that in the ordinary Ti-Al-N film at room temperature and the wear rate of Al-Cr-N film was 2 order smaller than that of Ti-Al-N film. The Al-Cr-N films show a small friction coefficient at 500°C and then they are recognized to have good tribological characteristics.

Original languageEnglish
Title of host publicationProceedings of the Second International Conference on Processing Materials for Properties
EditorsB. Mishra, C, Yamauchi, B. Mishra, C. Yamauchi
Pages291-296
Number of pages6
Publication statusPublished - 2000 Dec 1
EventProceedings of the Second International Conference on Processing Materials for Properties - San Francisco, CA, United States
Duration: 2000 Nov 52000 Nov 8

Publication series

NameProceedings of the Second International Conference on Processing Materials for Properties

Other

OtherProceedings of the Second International Conference on Processing Materials for Properties
CountryUnited States
CitySan Francisco, CA
Period00/11/500/11/8

ASJC Scopus subject areas

  • Engineering(all)

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