Flux-assisted self-assembly with microbump bonding for 3D heterogeneous integration

Yuka Ito, Takafumi Fukushima, Kang Wook Lee, Koji Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Abstract

We demonstrated a flip-chip self-assembly with Cu/Sn microbump bonding using surface tension of water-soluble fluxes. By using the self-assembly with the fluxes, 3-mm-square chips were aligned to hydrophilic assembly sites defined on a Si substrates in face-down bonding within approximately 2 μm alignment accuracy. The flux-assisted self-assembly can realize not only the precise chip alignment by high surface tension of the water-soluble fluxes, but also the highly reliable bump bonding with Sn solder in a sequence of self-assembly process. Here, we employed several fluxes as liquids for flip-chip self-assembly and compared the resulting alignment accuracies by changing concentrations of the fluxes. In addition, after microbump bonding, we evaluated electrical characteristics. The resulting daisy chains showed good electrical characteristics with contact resistances of 17 MΩ/bump or below without solder bridges and bonding failures.

Original languageEnglish
Title of host publication2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Pages891-896
Number of pages6
DOIs
Publication statusPublished - 2013 Sep 9
Event2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
Duration: 2013 May 282013 May 31

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
CountryUnited States
CityLas Vegas, NV
Period13/5/2813/5/31

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Ito, Y., Fukushima, T., Lee, K. W., Choki, K., Tanaka, T., & Koyanagi, M. (2013). Flux-assisted self-assembly with microbump bonding for 3D heterogeneous integration. In 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 (pp. 891-896). [6575679] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2013.6575679