Fluctuation mechanism of mechanical properties of electroplated-copper thin films used for three dimensional electronic modules

Hideo Miura, Kazuhiko Sakutani, Kinji Tamakawa

Research output: Contribution to journalConference articlepeer-review

29 Citations (Scopus)

Abstract

The mechanical properties of copper thin films deposited by sputtering and electroplating were compared using tensile test and nano-indentation. Both the Young's modulus and tensile strength of the films were found to vary drastically depending on the microstructure of the deposited films. The Young's modulus of the sputtered film was almost same as that of bulk material. However, the Young's modulus of the electroplated thin film was about a fourth of that of bulk material. The micro structure of the electroplated film was polycrystalline and a columnar structure with a diameter of a few hundred-micron. The strength of the grain boundaries of the columnar grains seemed to be rather week. In addition, there was a sharp distribution of Young's modulus along the thickness direction of the film. Though the modulus near the surface of the film was close to that of bulk material, it decreased drastically to about a fourth within the depth of about 1 micron. There was also a plane distribution of Young's modulus near the surface of the film.

Original languageEnglish
Pages (from-to)2954-2957
Number of pages4
JournalKey Engineering Materials
Volume353-358
Issue numberPART 4
DOIs
Publication statusPublished - 2007 Jan 1
EventAsian Pacific Conference for Fracture and Strength (APCFS'06) - Sanya, Hainan Island, China
Duration: 2006 Nov 222006 Nov 25

Keywords

  • Columnar structure
  • Electroplated copper film
  • Stress-strain curve
  • Thin film
  • Young' modulus

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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