Flow stress oscillation in silicon carbide during high temperature deformation

Sadahiro Tsurekawa, Yuichi Hasegawa, Hideo Yoshinaga, Yuichi Ikuhara

    Research output: Contribution to journalArticlepeer-review

    3 Citations (Scopus)

    Abstract

    In order to clarify the intrinsic nature of high temperature deformation of β-SiC without crack formation, pressureless sintered β-SiC with B+C additives as sintering aids has been deformed by compression at temperatures from 2070 to 2270 K and at strain rates from 6 × 10-6 to 7 × 10-5 s-1. Microstructures were also examined by scanning electron microscopy (SEM) and X-ray diffraction. It was found that the shape of stress-strain curves showed a regular oscillation. It was found that the shape of stress-strain curves showed a regular oscillation. The oscillation depended markedly on strain rate; the period and the amplitude of the flow stress oscillation respectively tend to decrease and to increase with decreasing strain rate. A change in grain shape was observed from acicular grain, which is characteristic of pressureless sintered β-SiC, to almost equiaxed one after deformation. Furthermore, X-ray diffraction analysis revealed that there was no definite sign of structure change, that is, the β structure was maintained after deformation. The observed phenomena were discussed from the viewpoint of dynamic recrystallization.

    Original languageEnglish
    Pages (from-to)263-270
    Number of pages8
    JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
    Volume59
    Issue number3
    DOIs
    Publication statusPublished - 1995

    ASJC Scopus subject areas

    • Condensed Matter Physics
    • Mechanics of Materials
    • Metals and Alloys
    • Materials Chemistry

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