Flow condition in resist spray coating and patterning performance for three-dimensional photolithography over deep structures

Vijay Kumar Singh, Minoru Sasaki, Kazuhiro Hane, Masayoshi Esashi

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

Spray coating of the photoresist is an attractive technique that offers new processes for realizing three-dimensional structures in a manner compatible with well-established planar photolithography. There are, however, many hurdles to overcome for its development, including the analysis of coating mechanism. Essentially, this is because the method used is the complex gas-liquid two-phase flow. In this paper, the detailed results relating to the resist film deposition inside microstructures of the Si wafer are described, while focusing on the pinhole distribution, which is a serious drawback of the application. In addition, the performance of the pattern transfer over deep (>1 mm) structures is investigated using a projection-type aligner.

Original languageEnglish
Pages (from-to)2387-2391
Number of pages5
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume43
Issue number4 B
DOIs
Publication statusPublished - 2004 Apr

Keywords

  • Incident angle
  • Pinhole density
  • Resist spray coating
  • Spray flow
  • Three-dimensional photolithography

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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