Flipped CMOS-diaphragm capacitive tactile sensor surface mountable on flexible and stretchable bus line

S. Asano, M. Muroyama, T. Bartley, T. Kojima, T. Nakayama, U. Yamaguchi, H. Yamada, Y. Nonomura, Y. Hata, H. Funabashi, S. Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The following novel configuration has been developed for a MEMS-CMOS integrated tactile sensor on a flexible and stretchable bus for covering a social robot body: 1) a sensing diaphragm is formed on a CMOS substrate by backside etching, and 2) the CMOS substrate is flip-bonded to a low temperature co-fired ceramic (LTCC) substrate. By this configuration, no through-silicon vias (TSVs) are needed, simplifying the fabrication process. The flipped CMOS substrate and the LTCC substrate were bonded and electrically connected using Au-Au bonding, which also formed differential capacitive gaps. A flexible and stretchable wire was fabricated by metal etching and polyimide laser cutting. The tactile sensors, which were mounted on the surface of the flexible bus, sent coded digital signals according to applied force.

Original languageEnglish
Title of host publication2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages97-100
Number of pages4
ISBN (Electronic)9781479989553
DOIs
Publication statusPublished - 2015 Aug 5
Event18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
Duration: 2015 Jun 212015 Jun 25

Publication series

Name2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015

Other

Other18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
CountryUnited States
CityAnchorage
Period15/6/2115/6/25

Keywords

  • Au-Au bonding
  • MEMS-CMOS integration
  • Stretchable wire
  • Surface mounting
  • Tactile sensor
  • Wafer-level packaging

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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