'FlexTrate ^TM' - Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP

Takafumi Fukushima, Arsalan Alam, Zhe Wan, Siva C. Jangam, Saptadeep Pal, Goutham Ezhilarasu, Adeel Bajwa, Subramanian S. Iyer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Citations (Scopus)

Abstract

We have developed a novel fan-out wafer level packaging (FOWLP) technology for high-performance and scalable flexible and biocompatible substrates that we call FlexTrate (TM). We demonstrate the technology with the assembly of 1-mm-sqaure 625 (25 by 25) Si dielets on a biocompatible Polydimethylsiloxane (PDMS). By using the new FOWLP technology, die-die interconnects with a pitch of 10 mm or less were implemented on the array of the Si dielets embedded in the PDMS.

Original languageEnglish
Title of host publicationProceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages649-654
Number of pages6
ISBN (Electronic)9781509043323
DOIs
Publication statusPublished - 2017 Aug 1
Event67th IEEE Electronic Components and Technology Conference, ECTC 2017 - Lake Buena Vista, United States
Duration: 2017 May 302017 Jun 2

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other67th IEEE Electronic Components and Technology Conference, ECTC 2017
CountryUnited States
CityLake Buena Vista
Period17/5/3017/6/2

Keywords

  • Bendable interconnect
  • Biocompatible
  • FOWLP
  • Flexible device integration
  • Metallization of PDMS

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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