Flexible and highly sensitive pressure sensor using multi-walled carbon nanotubes

Ryusaku Osada, Kanji Yumoto, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A flexible and highly sensitive pressure sensor using multiwalled carbon nanotube (MWCNT) was developed in order to assure safe and reliable operation of surgical assisting and care nursing robots. The investigation of the optimum growth condition for MWCNT was carried out to control the shape and size of the MWCNT. Electron beam evaporation (EB) method and arc plasma deposition (APD) method were used to deposit thin catalyst layers. Scanning probe microscope (SPM) was used to investigate the surface condition of the catalyst layers. In this investigation, it was made clear that depositing an iron catalyst layer of 5 nm was the best condition to fabricate MWCNT. In addition, a high quality MWCNT has been synthesized to develop a flexible and highly sensitive pressure sensor. In order to investigate the characteristics and sensitivity of the sensor, a loading test was carried out. It was found out, from this study, that the electrical resistance of the MWCNT sensor increased almost linearly with the applied load and the obtained gauge factor was about 70.

Original languageEnglish
Title of host publicationIMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
PublisherIEEE Computer Society
Pages218-221
Number of pages4
ISBN (Electronic)9781538647196
DOIs
Publication statusPublished - 2017 Jul 1
Event12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan, Province of China
Duration: 2017 Oct 252017 Oct 27

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2017-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Other

Other12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
CountryTaiwan, Province of China
CityTaipei
Period17/10/2517/10/27

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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