Finite-Element Analysis of Stress Distribution in a Film-Substrate System Induced by a Spherical Indenter (In Relation to Microfracture of a Film and an Interface)

Hiroyuki Kagawa, Masahiro Ichikawa Tohru Takamatsu, Hiroki Kuwano

Research output: Contribution to journalArticlepeer-review

Abstract

In order to investigate a method for evaluating the fracture strength of a film itself and the interface of a film-substrate system by means of indentation of a sphere, a finite-element analysis was carried out and the stress distribution was obtained. The analysis was made by assuming an elliptically distributed contact pressure. This assumption is almost valid within the range of parameters used in the present analysis. The ratio of the film thickness to the radius of the contact circle and the elastic properties of the film were varied. Dependences of the stresses relevant to microfracture of the film and the interface on the relative thickness and the elastic properties of the film were revealed. The results are useful in predicting and understanding the microfracture behavior of a film-substrate system.

Original languageEnglish
Pages (from-to)230-236
Number of pages7
JournalTransactions of the Japan Society of Mechanical Engineers Series A
Volume58
Issue number546
DOIs
Publication statusPublished - 1992 Jan 1
Externally publishedYes

Keywords

  • Contact Problem
  • Film
  • Finite-Element Method
  • Indentation
  • Numerical Analysis
  • Sphere Indenter
  • Stress Distribution

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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