Feasibility study of Cu paste printing technique to fill deep via holes for low cost 3D TSV applications

Hoang Tri Hai, Kanuku Ri, Daisuke Ando, Yuji Sutou, Mitsumasa Koyanagi, Junichi Koike

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science