Fast filling of through-silicon via (TSV) with conductive polymer/metal composites

Jin Kawakita, Barbara Horvath, Toyohiro Chikyow

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Toward fast formation of TSV for 3D-IC or 3D-LSI, a composite with polypyrrole as a conducting polymer and metal silver prepared through the solution photo chemistry was studied with respect to filling status of vertical holes in silicon chip, electrical characteristics and interfacial structures between the filling composite and silicon substrate. Based on the experimental results, the composite was capable of filling within 10 minutes, evaluation procedures of electrical resistance was established and excellent barrier layer was found.

Original languageEnglish
Title of host publication2015 International 3D Systems Integration Conference, 3DIC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
PagesTS8.14.1-TS8.14.5
ISBN (Electronic)9781467393850
DOIs
Publication statusPublished - 2015 Nov 20
Externally publishedYes
EventInternational 3D Systems Integration Conference, 3DIC 2015 - Sendai, Japan
Duration: 2015 Aug 312015 Sep 2

Publication series

Name2015 International 3D Systems Integration Conference, 3DIC 2015

Other

OtherInternational 3D Systems Integration Conference, 3DIC 2015
CountryJapan
CitySendai
Period15/8/3115/9/2

Keywords

  • Electric property
  • Polypyrrole
  • Silver
  • TSV

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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