@inproceedings{89fa7184bf844764aec8b29ce0d9e891,
title = "Fast filling of through-silicon via (TSV) with conductive polymer/metal composites",
abstract = "Toward fast formation of TSV for 3D-IC or 3D-LSI, a composite with polypyrrole as a conducting polymer and metal silver prepared through the solution photo chemistry was studied with respect to filling status of vertical holes in silicon chip, electrical characteristics and interfacial structures between the filling composite and silicon substrate. Based on the experimental results, the composite was capable of filling within 10 minutes, evaluation procedures of electrical resistance was established and excellent barrier layer was found.",
keywords = "Electric property, Polypyrrole, Silver, TSV",
author = "Jin Kawakita and Barbara Horvath and Toyohiro Chikyow",
year = "2015",
month = nov,
day = "20",
doi = "10.1109/3DIC.2015.7334583",
language = "English",
series = "2015 International 3D Systems Integration Conference, 3DIC 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "TS8.14.1--TS8.14.5",
booktitle = "2015 International 3D Systems Integration Conference, 3DIC 2015",
note = "International 3D Systems Integration Conference, 3DIC 2015 ; Conference date: 31-08-2015 Through 02-09-2015",
}