TY - JOUR
T1 - Fast and uniform heating of Cu microwires using electrical current
AU - Tohmyoh, Hironori
AU - Matsudo, Yohei
N1 - Publisher Copyright:
© 2015 The Japan Society of Applied Physics.
PY - 2015/4/1
Y1 - 2015/4/1
N2 - A fast and uniform heat treatment of 25-μm-thick Cu microwires was realized with Joule heating. To control the thermal boundary conditions around a wire, a constant direct current was supplied to the wire under vacuum conditions using current probes with sufficient heat capacity, and a uniform temperature distribution was realized in the wire. The grain size of the wire increased with the time for which current was supplied, and reached saturation within 10 s.
AB - A fast and uniform heat treatment of 25-μm-thick Cu microwires was realized with Joule heating. To control the thermal boundary conditions around a wire, a constant direct current was supplied to the wire under vacuum conditions using current probes with sufficient heat capacity, and a uniform temperature distribution was realized in the wire. The grain size of the wire increased with the time for which current was supplied, and reached saturation within 10 s.
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U2 - 10.7567/APEX.8.045503
DO - 10.7567/APEX.8.045503
M3 - Article
AN - SCOPUS:84927941527
VL - 8
JO - Applied Physics Express
JF - Applied Physics Express
SN - 1882-0778
IS - 4
M1 - 045503
ER -