Face-down bonding with sealed cavity for micromechanical device packaging

Masato Honma; Kazuyuki Minami; Masayoshi Esashi

Face-down bonding with sealed cavity for micromechanical device packaging

Masato Honma, Kazuyuki Minami, Masayoshi Esashi

Micro System Integration Center (μSIC)

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Face-down bonding of a chip which has a sealed cavity for micromechanical devices was developed. The sealed cavity was realized by adhesion of a frame formed around a working space of a micromechanical device to a substrate. Planarization of the frame surface, chip separation and face-down bonding are essential in this process. As a demonstration, we have successfully bonded a SAW device.

Original language	English
Pages (from-to)	23-31
Number of pages	9
Journal	Sensors and Materials
Volume	8
Issue number	1
Publication status	Published - 1996 Dec 1

Keywords

Bonding
Micromechanical device
Packaging
Planarization

ASJC Scopus subject areas

Instrumentation
Materials Science(all)

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Cite this

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abstract = "Face-down bonding of a chip which has a sealed cavity for micromechanical devices was developed. The sealed cavity was realized by adhesion of a frame formed around a working space of a micromechanical device to a substrate. Planarization of the frame surface, chip separation and face-down bonding are essential in this process. As a demonstration, we have successfully bonded a SAW device.",

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N2 - Face-down bonding of a chip which has a sealed cavity for micromechanical devices was developed. The sealed cavity was realized by adhesion of a frame formed around a working space of a micromechanical device to a substrate. Planarization of the frame surface, chip separation and face-down bonding are essential in this process. As a demonstration, we have successfully bonded a SAW device.

AB - Face-down bonding of a chip which has a sealed cavity for micromechanical devices was developed. The sealed cavity was realized by adhesion of a frame formed around a working space of a micromechanical device to a substrate. Planarization of the frame surface, chip separation and face-down bonding are essential in this process. As a demonstration, we have successfully bonded a SAW device.

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