Abstract
Face-down bonding of a chip which has a sealed cavity for micromechanical devices was developed. The sealed cavity was realized by adhesion of a frame formed around a working space of a micromechanical device to a substrate. Planarization of the frame surface, chip separation and face-down bonding are essential in this process. As a demonstration, we have successfully bonded a SAW device.
| Original language | English |
|---|---|
| Pages (from-to) | 23-31 |
| Number of pages | 9 |
| Journal | Sensors and Materials |
| Volume | 8 |
| Issue number | 1 |
| Publication status | Published - 1996 Dec 1 |
Keywords
- Bonding
- Micromechanical device
- Packaging
- Planarization
ASJC Scopus subject areas
- Instrumentation
- Materials Science(all)