Face-down bonding of a chip which has a sealed cavity for micromechanical devices was developed. The sealed cavity was realized by adhesion of a frame formed around a working space of a micromechanical device to a substrate. Planarization of the frame surface, chip separation and face-down bonding are essential in this process. As a demonstration, we have successfully bonded a SAW device.
|Number of pages||9|
|Journal||Sensors and Materials|
|Publication status||Published - 1996 Dec 1|
- Micromechanical device
ASJC Scopus subject areas
- Materials Science(all)