Face-down bonding with sealed cavity for micromechanical device packaging

Masato Honma, Kazuyuki Minami, Masayoshi Esashi

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)

Abstract

Face-down bonding of a chip which has a sealed cavity for micromechanical devices was developed. The sealed cavity was realized by adhesion of a frame formed around a working space of a micromechanical device to a substrate. Planarization of the frame surface, chip separation and face-down bonding are essential in this process. As a demonstration, we have successfully bonded a SAW device.

Original languageEnglish
Pages (from-to)23-31
Number of pages9
JournalSensors and Materials
Volume8
Issue number1
Publication statusPublished - 1996 Dec 1

Keywords

  • Bonding
  • Micromechanical device
  • Packaging
  • Planarization

ASJC Scopus subject areas

  • Instrumentation
  • Materials Science(all)

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