Fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer arrays using glass reflow process

Nguyen Van Toan; Shim Hahng; Yunheub Song; Takahito Ono

doi:10.3390/mi7050076

Fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer arrays using glass reflow process

Nguyen Van Toan, Shim Hahng, Yunheub Song, Takahito Ono

ENG - Mechanical Systems Engineering

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5*5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 μm and sensing gap of 3.2 μm (distance between top and bottom electrodes) is observed at 2.84 MHz. The Q factor is approximately 1300 at pressure of 0.01 Pa.

Original language	English
Article number	76
Journal	Micromachines
Volume	7
Issue number	5
DOIs	https://doi.org/10.3390/mi7050076
Publication status	Published - 2016 Jan 1

Keywords

Anodic bonding
Capacitive micromachined ultrasonic transducer
Chemical sensing
Glass reflow process
Medical imaging
Non-destructive measurement

ASJC Scopus subject areas

Control and Systems Engineering
Mechanical Engineering
Electrical and Electronic Engineering

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10.3390/mi7050076

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title = "Fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer arrays using glass reflow process",

abstract = "This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5*5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 μm and sensing gap of 3.2 μm (distance between top and bottom electrodes) is observed at 2.84 MHz. The Q factor is approximately 1300 at pressure of 0.01 Pa.",

keywords = "Anodic bonding, Capacitive micromachined ultrasonic transducer, Chemical sensing, Glass reflow process, Medical imaging, Non-destructive measurement",

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N2 - This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5*5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 μm and sensing gap of 3.2 μm (distance between top and bottom electrodes) is observed at 2.84 MHz. The Q factor is approximately 1300 at pressure of 0.01 Pa.

AB - This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques. Silicon through-wafer interconnects have been investigated by the glass reflow process. Then, the patterned silicon-glass reflow wafer is anodically bonded to an SOI (silicon-on-insulator) wafer for the fabrication of CMUT devices. The CMUT 5*5 array has been successfully fabricated. The resonant frequency of the CMUT array with a one-cell radius of 100 μm and sensing gap of 3.2 μm (distance between top and bottom electrodes) is observed at 2.84 MHz. The Q factor is approximately 1300 at pressure of 0.01 Pa.

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