Fabrication of Ultrasonic Sensors Using Micro Cantilevers and Characteristic Measurement in Vacuum for Acoustic Emission Sensing

Kengo Takata, Takashi Sasaki, Mitsuyuki Tanaka, Hiroshi Saito, Daisuke Matsuura, Kazuhiro Hane

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Acoustic emission (AE) sensors are attractive for the detection of machine fracture in real time. We fabricated AE sensors using the MEMS technology. The AE sensors consisted of silicon cantilevers resonating at frequencies of 50, 100, and 150 kHz. Silicon piezoresistors were installed close to the cantilevers. In order to obtain an ambient pressure appropriate for the operation of the cantilevers, the Q factor of the cantilevers was calculated by analytical models as a function of pressure. The properties of the fabricated sensors were measured in a vacuum chamber. We also tentatively packaged the AE sensor and an amplifier in a vacuum to decrease the influences of air damping and noise.

Original languageEnglish
Pages (from-to)68-74
Number of pages7
JournalElectronics and Communications in Japan
Volume99
Issue number4
DOIs
Publication statusPublished - 2016 Apr 1

Keywords

  • Q factor
  • acoustic emission sensor
  • piezo resistance
  • silicon cantilever
  • vacuum package

ASJC Scopus subject areas

  • Signal Processing
  • Physics and Astronomy(all)
  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Applied Mathematics

Fingerprint Dive into the research topics of 'Fabrication of Ultrasonic Sensors Using Micro Cantilevers and Characteristic Measurement in Vacuum for Acoustic Emission Sensing'. Together they form a unique fingerprint.

  • Cite this