Fabrication of the tip of GaAs microwave probe by wet etching

Yang Ju; Hiroyuki Sato; Hitoshi Soyama

Fabrication of the tip of GaAs microwave probe by wet etching

Yang Ju, Hiroyuki Sato, Hitoshi Soyama

ENG - Finemechanics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

13 Citations (Scopus)

Abstract

In order to develop a new structure microwave probe, the fabrication of micro tip on the GaAs wafer surface was studied. The effects of the shape, direction, and size of etching mask to the fabricated tip were discussed in details. By finding the most suitable etching conditions, a tip having 7 μm high, 1.4 aspect ratio, and 50 nm curvature radius was formed. The experimental result indicates that the tip having the similar capability to sense the surface topography of materials as that of commercial atom force microscope (AFM) probe.

Original language	English
Title of host publication	Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publication	Advances in Electronic Packaging 2005
Pages	1919-1922
Number of pages	4
Publication status	Published - 2006 Feb 23
Event	ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States Duration: 2005 Jul 17 → 2005 Jul 22

Publication series

Name	Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Volume	PART C

Other

Other	ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Country	United States
City	San Francisco, CA
Period	05/7/17 → 05/7/22

ASJC Scopus subject areas

Engineering(all)

Access to Document

Fingerprint Dive into the research topics of 'Fabrication of the tip of GaAs microwave probe by wet etching'. Together they form a unique fingerprint.

Cite this

Ju, Y., Sato, H., & Soyama, H. (2006). Fabrication of the tip of GaAs microwave probe by wet etching. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (pp. 1919-1922). (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; Vol. PART C).

Fabrication of the tip of GaAs microwave probe by wet etching. / Ju, Yang; Sato, Hiroyuki; Soyama, Hitoshi.

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. 2006. p. 1919-1922 (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; Vol. PART C).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ju, Y, Sato, H & Soyama, H 2006, Fabrication of the tip of GaAs microwave probe by wet etching. in Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, vol. PART C, pp. 1919-1922, ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, San Francisco, CA, United States, 05/7/17.

Ju Y, Sato H, Soyama H. Fabrication of the tip of GaAs microwave probe by wet etching. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. 2006. p. 1919-1922. (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005).

Ju, Yang ; Sato, Hiroyuki ; Soyama, Hitoshi. / Fabrication of the tip of GaAs microwave probe by wet etching. Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. 2006. pp. 1919-1922 (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005).

@inproceedings{2ecd0d7f454c4aa389ca47c799f87814,

title = "Fabrication of the tip of GaAs microwave probe by wet etching",

abstract = "In order to develop a new structure microwave probe, the fabrication of micro tip on the GaAs wafer surface was studied. The effects of the shape, direction, and size of etching mask to the fabricated tip were discussed in details. By finding the most suitable etching conditions, a tip having 7 μm high, 1.4 aspect ratio, and 50 nm curvature radius was formed. The experimental result indicates that the tip having the similar capability to sense the surface topography of materials as that of commercial atom force microscope (AFM) probe.",

author = "Yang Ju and Hiroyuki Sato and Hitoshi Soyama",

year = "2006",

month = feb,

day = "23",

language = "English",

isbn = "0791842002",

series = "Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005",

pages = "1919--1922",

booktitle = "Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems",

note = "ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 ; Conference date: 17-07-2005 Through 22-07-2005",

}

TY - GEN

T1 - Fabrication of the tip of GaAs microwave probe by wet etching

AU - Ju, Yang

AU - Sato, Hiroyuki

AU - Soyama, Hitoshi

PY - 2006/2/23

Y1 - 2006/2/23

N2 - In order to develop a new structure microwave probe, the fabrication of micro tip on the GaAs wafer surface was studied. The effects of the shape, direction, and size of etching mask to the fabricated tip were discussed in details. By finding the most suitable etching conditions, a tip having 7 μm high, 1.4 aspect ratio, and 50 nm curvature radius was formed. The experimental result indicates that the tip having the similar capability to sense the surface topography of materials as that of commercial atom force microscope (AFM) probe.

AB - In order to develop a new structure microwave probe, the fabrication of micro tip on the GaAs wafer surface was studied. The effects of the shape, direction, and size of etching mask to the fabricated tip were discussed in details. By finding the most suitable etching conditions, a tip having 7 μm high, 1.4 aspect ratio, and 50 nm curvature radius was formed. The experimental result indicates that the tip having the similar capability to sense the surface topography of materials as that of commercial atom force microscope (AFM) probe.

UR - http://www.scopus.com/inward/record.url?scp=32844466337&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=32844466337&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:32844466337

SN - 0791842002

T3 - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

SP - 1919

EP - 1922

BT - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems

T2 - ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Y2 - 17 July 2005 through 22 July 2005

ER -