Abstract
In order to develop a new structure microwave probe, the fabrication of micro tip on the GaAs wafer surface was studied. The effects of the shape, direction, and size of etching mask to the fabricated tip were discussed in details. By finding the most suitable etching conditions, a tip having 7 μm high, 1.4 aspect ratio, and 50 nm curvature radius was formed. The experimental result indicates that the tip having the similar capability to sense the surface topography of materials as that of commercial atom force microscope (AFM) probe.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems |
| Subtitle of host publication | Advances in Electronic Packaging 2005 |
| Pages | 1919-1922 |
| Number of pages | 4 |
| Publication status | Published - 2006 Feb 23 |
| Event | ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States Duration: 2005 Jul 17 → 2005 Jul 22 |
Publication series
| Name | Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 |
|---|---|
| Volume | PART C |
Other
| Other | ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 |
|---|---|
| Country | United States |
| City | San Francisco, CA |
| Period | 05/7/17 → 05/7/22 |
ASJC Scopus subject areas
- Engineering(all)
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Cite this
Ju, Y., Sato, H., & Soyama, H. (2006). Fabrication of the tip of GaAs microwave probe by wet etching. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (pp. 1919-1922). (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; Vol. PART C).